microelectronics Lab (MEL)

HRL's Microelectronics Laboratory has a team of talented and motivated engineers and scientists focused on advancing the state of the art in ultra-high-performance integrated circuits. Innovations in materials, device physics, wafer fabrication at nanometer dimensions, integrated circuit design, and subsystem architecture have enabled the realization of miraculous new technologies.

MEL researchers are exploiting advances in analog signal processing, sampling theory, hybrid analog/digital computing, and analog VLSI circuits to develop novel analog processing approaches for advanced military and commercial systems. The goal is to achieve low-cost, low-power, chip-scale RF transceivers, sensor systems, and analog processor devices.

In the realm of digital mixed-signal ICs, MEL has been breaking new ground to enhance system and subsystem impact. High-performance indium phosphide (InP) heterojunction bipolar transistor (HBT) technology continues to be a key area of expertise, with researchers rapidly developing expertise in both silicon (CMOS) IC design and integration of InP HBT technology with CMOS.

The Microelectronics Laboratory has also made significant progress in the area of gallium nitride (GaN) heterostructure field effect transistor (HFET) technology for both power electronics applications and high-performance monolithic millimeter-wave integrated circuits (MMICs). We were the first organization in the world to demonstrate a W-band GaN MMIC power amplifier.

HRL also continues to be a leader in low-noise MMICs for radiometers, which are used in millimeter-wave imaging systems for navigation through fog and concealed weapons detection. In 2008, MEL researchers also made a major breakthrough in developing the world's first RF graphene field effect transistor.

Current Openings

  • Research Staff, IC Design & Hardware Engineering - 1531.09
  • Development Engineer Sr. - 1631.04
  • Development Engineer Sr., Equipment Engineer - 1631.05
  • Research Staff Member, Power and Signal Integrity Engineering - 1631.07
  • Development Engineer, Sustaining - 1631.09
  • Research Staff, ASIC Backend Physical Design Engineer, Sr. - 1631.12
  • Development Engineer Sr., Mixed Signal Circuits - 1631.13
  • Development Engineer, RF Engineer - 1631.15
  • Research Staff, Analog/Mixed Signal Integrated Circuits - 1631.16
  • Research Staff, Device Engineering (NanoElectronics) - 1731.02
  • Development Engineer Sr., Advanced Printed Circuit Board and Package Design - 1731.04
  • Research Staff, Systems Engineer - 1731.05
  • Sr. Research Project Engineer, Research Staff, 3D Processing and Assembly - 1731.06
  • Development Engineer, Test Engineer - 1731.07
  • Development Engineer, Design and Layout Engineer, Advanced Printed Circuit Board and Package Design - 1731.08
  • Research Staff, SR Hardware Integration Engineer - 1731.09
  • Research Staff, Electron Beam Lithography - 1731.10


  • Intern, Integrated Circuit Design - FB10870
  • Intern, Semiconductor Device Development - FB10871
  • Intern, Hardware Assembly & Test - FB10872


Areas of Research

  • Asynchronous Pulse Processing (low-power, high-performance analog signal processing) for RF Transmitters and Receivers
  • GaN HFET Technology for Millimeter-Wave Power Amplifiers
  • Power Conversion Based on GaN HFET Switches and Diodes
  • Integration of High-Performance III-V Technology with Silicon CMOS
  • Analog-to-Digital Converters Based on InP HBT Technology
  • Direct Digital Synthesis Based on InP HBT Technology
  • Low-Noise InP HEMT and Sb Diode MMICs for Millimeter-Wave Imaging
  • Millimeter-Wave Imaging System Analysis
  • Graphene-Based Electronics
  • 3D GaN MMIC Technology
  • W-Band Sensor Modules
  • Wide Bandgap Power Electronics
  • W-Band, V-Band and D-Band Power Sources